39 ?2010 littelfuse, inc. revised: february 9, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array sp3001 lead-free/green series lead-free/green sp3001 description features applications the sp3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level speci?ed in the iec 61000-4-2 international standard ( level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. sp3001 lead-free/green series rohs pb green t - p x d b q b d j u b o d f p g 0.65pf (typ) per i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, 15kv air discharge, (iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m 4 $ q b d l b h f saves board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 2.5a (8/20s) t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t 1 % " t t % j h j u b m $ b n f s b t t / f u x p s l ) b s e x b s f 1 p s u t t 5 f t u & r v j q n f o u t . f e j d b m & r v j q n f o u pinout i/o 1 i/o 2 v cc i/o 3 i/o 4 gnd functional block diagram i/o2 i/o1 gnd i/o3 v cc i/o4 hf - j g f 4 v q q p s u / p u f not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
4 0 revised: february 9, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3001 lead-free/green series electrical characteristics (t op =25 o c) thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 9.5 11.0 v i pp =2a, t p =8/20s, fwd 10.6 13.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 8 kv iec61000-4-2 (air) 15 kv diode capacitance 1 c * 0 ( / % reverse bias=0v 0.8 0.9 pf reverse bias=1.65v 0.55 0.65 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.35 pf / p u f 1 b s b n f u f s j t h v b s b o u f f e c z e f t j h o b o e p s e f w j d f d i b s b d u f s j [ b u j p o caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2.5 a t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c
4 1 ?2010 littelfuse, inc. revised: february 9, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array sp3001 lead-free/green series lead-free/green sp3001 capacitance vs. bias voltage insertion loss (s21) i/o to gnd -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency [hz] insertion loss [db] 1. 0 0 0.95 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 i/o capacitance (pf) i/o dc bias (v) v cc = 5 v v cc = float v cc = 3.3v capacitance vs. frequency 0 2e-13 4e-13 6e-13 8e-13 1e-12 1.2e-12 1.4e-12 1.e+06 1.e+07 1.e+08 1.e+09 frequency [hz] capacitance [f]
4 2 revised: february 9, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3001 lead-free/green series application example re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) ? $ - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters clk+ gnd clk- d2+ gnd d2- d1+ gnd d1- d0+ gnd d0- hdmi or dvi connector hdmi or dvi interface ic d0+ d0- d1+ d1- d2+ d2- clk+ clk- 6 5 4 sp300x-04 1 2 3 +5v gnd 6 5 4 sp300x-04 1 2 3 hdmi or dvi application example for the littelfuse sp300x-04 protection devices. a single 4 channel sp300x-04 device can be used to protect four of the data lines in a hdmi/dvi interface. two (2) sp300x-04 devices provide protection for the main data lines. low voltage asic hdmi/dvi drivers can also be protected with the sp300x-04, the +v cc pins on the sp300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +v cc of the sp300x-04 can be n p b u f e p s / $
4 3 ?2010 littelfuse, inc. revised: february 9, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array sp3001 lead-free/green series lead-free/green sp3001 package dimensions - sc70-6 package sc70-6 pins 6 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.094 l 0.26 0.46 0.010 0.018 d a2 a a1 c l e he 2 1 3 6 5 4 e e b part numbering system product characteristics ordering information part number package marking min. order qty. SP3001-04JTG 4 $ d x 4 3000 lead plating matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 part marking system / p u f t 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. sp 3001 -04 j t g silicon protection array series number of channels -04 = 4 channel package j = sc70-6, 3000 quantity t= tape & reel g= green d x 4 d x 4 product series d = sp3001 series assembly site (varies) number of channels solder pad layout
44 revised: february 9, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3001 lead-free/green series embossed carrier tape & reel speci?cation - sc70-6 symbol millimetres inches min max min max e 1.65 1.85 0.064 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.081 d 1.40 1.60 0.055 0.062 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.153 0.161 10p0 40.0+/- 0.20 w 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.960 k0 1.12 1.32 0.044 0.052 t n b y 0.010 max
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